TLX-9 2-Layer 50mil Immersion Tin PCB for RF Communications
1. Introduction
TLX-9 is a composite of PTFE/woven glass laminates with exceptionally well controlled electrical and mechanical properties. TLX-9 laminates can be sheared, drilled, milled and plated using standard methods for PTFE/woven fiberglass materials. The laminates are dimensionally stable, and exhibit virtually no moisture absorption during fabrication processes.
TLX-9 measured 2.5 DK with tightly controlled across a broad frequency range and temperature spectrum. The dissipation factor is approximately 0.0019 when measured at 10 GHz. TLX-9 meets stringent flammability standards, achieving a UL 94 V-0 certification for flame retardancy.
2. Key Features
Stable Dielectric Constant: 2.5 @ 10 GHz
Loss Characteristics: Dissipation Factor 0.0019 @ 10 GHz
Excellent Insulation: Dielectric Breakdown >60 kV
Environmental Resistance: Moisture Absorption <0.02%
High Reliability: Volume Resistivity 10^7 Mohm/cm, Surface Resistivity 10^7 Mohm
Mechanical Strength: Flexural Strength Lengthwise >23,000 lbs./in., Crosswise >19,000 lbs./in.
Strong Bonding: Peel Strength 12 lbs./linear in.
Thermal Management: Thermal Conductivity 0.19 W/m/K.
Dimensional Stability: x-y CTE 9-12 ppm/°C, z CTE 130-145 ppm/°C
Safety Certified: UL-94 V-0 Flammability Rating
3. Benefits
Superior Electrical Performance: Low Dielectric Constant, Low Dissipation Factor
Environmental Durability: Low Moisture Absorption
High Voltage Capability: High Dielectric Breakdown
Mechanical Reliability: Good Peel Strength
Thermal Stability: Controlled Coefficient of Thermal Expansion (CTE)
4. PCB Construction Details
| Parameter | Specification |
|---|
| Base Material | TLX-9 |
| Layer Count | 2 layers |
| Board Dimensions | 57mm × 136mm = 1PC, ±0.15mm |
| Minimum Trace/Space | 6/6 mils |
| Minimum Hole Size | 0.3mm |
| Blind Vias | No |
| Finished Board Thickness | 1.35mm |
| Finished Cu Weight | 1oz (1.4 mils) outer layers |
| Via Plating Thickness | 20 μm |
| Surface Finish | Immersion tin |
| Top Silkscreen | White |
| Bottom Silkscreen | No |
| Top Solder Mask | No |
| Bottom Solder Mask | No |
| Identification | Printing series number for identification |
| Electrical Test | 100% tested prior to shipment |
5. PCB Stackup (2-Layer Rigid Structure)
Copper_layer_1 - 35
Taconic TLX-9 Core - 1.27 mm (50mil)
Copper_layer_2 - 35 μm
6. PCB Statistics:
Components: 32
Total Pads: 64
Thru Hole Pads: 36
Top SMT Pads: 28
Bottom SMT Pads: 0
Vias: 97
Nets: 2
7. Typical Applications
LNAs, LNBs, and LNCs
Personal Communications Service / Personal Communications Network (PCS/PCN) Large Format Antennas
High Power Amplifiers
Passive Components
8. Quality Assurance
Artwork Format: Gerber RS-274-X
Accepted Standard: IPC-Class-2
Availability: Worldwide
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